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| General |
Layers |
up to 8 layers |
up to 12 layers |
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Board Thickness |
0.6 ~ 2.4 |
3.2 |
mm |
| |
Dimension - Max. |
19"X22" |
- |
inch |
| |
Impedance Control |
+/-10 |
+/-8 |
% |
| |
Warpage and Twist |
0.75% |
- |
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| Material |
CEM - 3 |
Available |
- |
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| |
FR4 Tg 140 |
Available |
- |
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| |
FR4 Tg. 150 ~ 170 |
Available |
- |
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Halogen Free |
Available |
- |
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| |
| Innerlayer |
Minimum Space Line to line |
3/3 |
- |
mil |
| |
Registration Tolerance |
2 |
- |
mil |
| |
Max. Working panel Board Size |
21x24 |
- |
inch |
| |
Minimum Core Thickness |
2 |
- |
mil |
| |
Etching undercut(total) |
2 |
- |
mil |
| |
Circuit width tolerance |
+/-20 |
- |
% |
| |
Copper weight |
1/2 ~ 4 |
6 |
OZ |
| Lamination |
Layer-Layer Registration |
3 |
2 |
mil |
| |
+/- Tolerance |
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Copper weight ( external ) |
1/2 to 3 |
> 4 |
OZ |
| |
Max. Working panel Board Size |
21x24 |
- |
inch |
| |
Board thickness tolerance |
+/- 4 |
|
mil |
| |
| Drilling |
Drill Size |
0.25-6.40 |
0.2-6.40 |
mm |
| |
Max. Working panel Board Size |
21x24 |
- |
inch |
| |
Roughness |
1.2 |
- |
mil |
| |
| PTH |
Aspect Ratio |
6.4:1 |
8:1 |
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| |
Minimum PTH Hole Diameter +/- Tolerance |
8 |
- |
mil |
| |
| Outer Layer |
Minimum Space Line to line |
4/4 |
3/3 |
mil |
| |
| Pattern plating |
Max Copper Weight: Plane& Signal |
6 |
- |
OZ |
| |
Circuit width tolerance |
+/-20 |
- |
% |
| |
| Solder Mask |
Soldermask Registration Tolerance |
3 |
2 |
mil |
| |
Solder Dam |
3 |
2.5 |
mil |
| |
Soldermask Thickness |
>= 0.4 |
- |
mil |
| |
| Surface Finish |
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| 1. Electrolytic Gold Plating |
Process windows Au (Thickness) |
5 ~ 40 |
- |
u" |
| |
Process Windows Ni (Thickness) |
200 ~ 700 |
- |
u" |
| |
| 2. HASL (Leaded) |
Process windows (Thickness) |
70~1000 |
|
u" |
| |
HASL Type |
Leaded |
Pb/free |
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| 3. OSP |
Process windows (Thickness) |
0.2-0.3 |
- |
um |
| |
OSP Type |
Shikoku F2 |
- |
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| |
| 4. Immersion Gold |
Process windows Au (Thickness) |
1 ~ 5 |
- |
u" |
| |
Process windows Ni (Thickness) |
150 ~ 400 |
- |
u" |
| |
| 5. Immersion Silver |
Process windows (Thickness) |
6 ~ 20 |
- |
u" |
| |
| 6. Peelable Mask |
Process windows (Thickness) |
200 ~ 300 |
- |
um |
| |
| 7. Carbon printing |
Process windows (Resistance) |
35 ~ 10K |
- |
ohm |
| |
| 8. Legend printing |
Minimum Space Line |
8 |
- |
mil |
| |
Registration Tolerance |
6 |
5 |
mil |
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| Outline |
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| 1.Router |
Size Tolerance |
+/- 5 |
- |
mil |
| |
| 2. V-cut |
Deficient Thickness |
12 |
8 |
mil |
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Max. Working Panel Size |
20 x 20 |
- |
inch |
| |
Min. Skipping Custting Distance |
8 |
5 |
mm |
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| Electrical Testing |
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| 1. Universal Tester |
Maximum Test Points Per Board (O/S Test) |
65,536 |
- |
points |
| |
Minimum SMT Feature Pitch |
16 |
- |
mil |
| |
Max.Board size |
20" X 24" |
- |
inch |
| |
Continuity Test |
10 |
- |
Ohm |
| |
Isolation Test |
10M |
- |
Ohm |
| |
| 2. Dedicated Test Machine |
Minimum SMT Feature Pitch |
20 |
- |
mil |
| |
Max.Board size |
18" x 24" |
- |
inch |
| |
Continuity Test |
20 |
- |
Ohm |
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Isolation Test |
20 ~ 100 M |
- |
Ohm |
