OUR SPECAILTY PROCESS

1. High Resistance Carbon Printing
   
2. Shunt Circuit Resistor PCB
   
3. Impedance/Differential Control at 50, 100 OHMS +/-10%
   
4. Heavy copper capability;
   - Surface copper finish maximum at 6 oz
   - Inner layer maximum at 4 oz (4L product)

SURFACE FINISHING

• Hot Air Surface Leveling, Non-RoHS compliant
• Carbon Contact & Jumper Printing
• OSP/Entek (Chemical: Shikoku F2, High Temperature Chemical for Pb/free soldering process) RoHS Compliant.
• Electroless Ni/Au finish 0.075 – 0.125 µm.thk (ENIG, RoHS Compliant)
• Electroplating Gold (Bar connected, RoHS Compliant)
• Peelabel Soldermask Printing
• Immersion Silver (Chemical: MacDermid) RoHS Compliant

SINGLE PROCESS SUB CONTRACT

1. Lead Free Hot Air Surface Leveling (Solder Bar type: SN100C), RoHS Compliant.
2. Immersion Tin (Chemical Type: Atotech), RoHS Compliant.